mobile fingerprint module cover solution -金沙2004路线js5

mobile fingerprint module cover solution




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glass cover plate

the glass cover plate supports a maximum thickness of 145um. the glass cover plate fingerprint recognition solution module has the characteristics of high hardness, high brightness, good glossiness, and easy color matching, which can better match the overall color and design style requirements of the phone. at the same time, it has the characteristics of simple module technology, low cost, and mature industrial chain, making it a cost-effective fingerprint recognition solution.

ceramic cover plate

ceramic cover plate fingerprint recognition solution supports the industry's thickest 120 μ the ceramic cover plate not only improves the pressure resistance and impact resistance of fingerprint recognition, but also ensures the reliability of fingerprint recognition.

sapphire cover plate

the sapphire cover plate supports a maximum thickness of 175um. the sapphire cover plate fingerprint recognition solution revolves around the user experience and has advantages such as stable reliability, aesthetics, and practicality. in terms of appearance design, the sapphire cover plate is embedded in a corrosion-resistant metal frame, and high-density sensor components are integrated to provide users with safe and reliable protection.





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